Spray Is Cooling Disguised as Lubrication
What the spray actually does
The release agent shot cools the die face, lays down a parting film and blows out chips. Under-spray risks soldering of aluminium to steel and pull-out damage; over-spray builds die wax, dulls surfaces and adds porosity by wetting the cavity.
Volume, concentration and dwell time move together: a thinner mix needs more dwell or more volume to film the same surface.
Tuning without trial and error
Change one variable at a time and hold the shot for a full shift; die surfaces respond over dozens of cycles. Watch for soldering at thin ribs first, and die wax accumulation on flat faces as the over-spray signal.
Log spray parameters with cast quality by cavity position; the cavities furthest from the sprue usually show spray starvation first.
FAQ
Does more release agent mean fewer defects?
No. Past the needed film, extra spray adds porosity and wax build-up while lengthening the cycle.
Why does soldering appear at the same spot?
Recurrent soldering usually marks spray shadowing or a hot spot. Check nozzle aim and local cooling before blaming the agent.
Can spray time be cut to raise output?
Only until defects rise. The spray dwell is also the die's main cooling window; cutting it shifts heat into the die and the next shots.
All figures above refer to standard product data sheets; final confirmation is subject to written quotation.